TSMC 2nm Chips will Be in Mass Production in 2025

On August 30th, Taiwan Semiconductor Manufacturing Co. (TSMC)’s CEO said at a chipmaker’s technology symposium held in Hsinchu (新竹) that the company would launch large-scale production of 2nm chips in 2025.

TSMC disclosed that the “Gate-All-Around” (GAA) structure will be used in manufacturing 2nm chips to eliminate undesired variability and mobility loss. This makes the production technology most competitive and efficient in the market. It is expected that 3nm process chips will be replaced in the next two years.

The 2nm chip operates 10-15% quicker at the same power consumption, while the power consumption is lowered by 25–30% at the same speed. At present, the 2nm process still needs further improvements in terms of transistor density. Therefore, the mass production of 2nm chips will have to wait until the second half of 2025, which means that the end product shipments will have to wait until 2026.

According to sources, TSMC plans to build a wafer fab using the 2nm process in Hsinchu (新竹), northern Taiwan, and to expand the technology to Taichung City. At the same symposium, TSMC also announced to begin mass production of 3nm chips this September, with the first customers including Apple Inc. and Intel Corp.

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